Central Air Abatement System (CAAS) Scrubbing in Semiconductor Manufacturing

A number of sources in the semiconductor manufacturing process produce diluted levels of acid gases, silanes, ammonia and some organics. The most common gases are hydrochloric acid (HCl), hydrofluoric acid (HF), hydrobromic acid (HBr), phosphoric acid (H3PO4), nitric acid (HNO3) and ammonia (NH3).

A major supplier of flash memory chips chose Verantis to supply 24 systems to treat approximately 600,000 CFM from the central air abatement system. The acid and ammonia exhaust sources were segregated and treated in our SPT Series Countercurrent scrubbers containing high efficiency Type 3-K Tellerette® packing. Included with each individual scrubber was a Verantis model CLUB-4450 FRP fan. The CLUB series fan is ideal for semiconductor processes where low vibration operation is critical. With a direct drive motor arrangement the CLUB series offers the lowest vibration levels available at 0.025in/sec.

ApplicationCAAS Exhaust
Exhaust Volume25,000 CFM per tower
(24 Systems provided)
Exhaust Temperature80° F
Exhaust Pressure2.6” W.C. per tower
ContaminantHCl, HF, HBr, HNO3, H3PO4, NH3
Removal Efficiency99% per tower
Scrubbing SolutionDilute NAOH or H2SO4
Materials of ConstructionFRP